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Zymet: Adhesives and Encapsulants Zymet specializes in adhesives and encapsulants for electronics, offering solutions like conductive adhesives and underfill encapsulants for reliability and performance
Reworkable Edgebond Adhesives | Zymet Zymet's reworkable edgebond adhesives enhance board level reliability and ruggedize 3D and 2 5D packages, FO-WLP's, WLCSP's, BGA's, CSP's and QFN's They are used in high performance (HPC), enterprise, automotive, aerospace and consumer applications
About Zymet Zymet counts amongst its customers world-class multinational companies that are leaders in their industries Customers include manufacturers of handheld and consumer electronics, computers, storage devices, automotive electronics, medical electronics, and military electronics
Underfill Encapsulants - Zymet Zymet's high reliability underfill encapsulants both ruggedize and enhance board level reliability Their thermomechanical properties make them suited for enterprise, automotive, and other harsh environment applications
ULTRA-LOW STRESS DIE ATTACH ADHESIVE FOR STRESS SENSITIVE DEVICES - Zymet EAST HANOVER, N J - Zymet is offering an ultra-low stress die attach adhesive, TC-601 1, uniquely suited for bonding of stress sensitive devices such as microelectronic and micro-machined sensors In the case of a microelectronic sensor, bending can generate unwanted piezoelectric signals
Zymet | Products Zymet Products Adhesives Reworkable Edgebond Adhesives Ruggedize and raise board level reliability Anisotropically Conductive Adhesives Electrically interconnect and ground Electrically Conductive Adhesives Die attach and general electronics assembly Thermally Conductive Adhesives Dissipate heat Non-Conductive Pastes (NCPs)
News | Zymet Zymet has introduced a new reworkable low-CTE underfill encapsulant, CN-1735, designed to enhance the board level thermal cycle performance of IC packages with pitches as fine as 0 3- mm pitch
Reworkable Underfill Encapsulants | Zymet However, these packages are not designed to survive drop and bend and twist tests or shock and vibration tests Zymet offers underfill encapsulants to enhance the board level reliability of these area array packages in harsh environments