- Zymet: Adhesives and Encapsulants
Zymet specializes in adhesives and encapsulants for electronics, offering solutions like conductive adhesives and underfill encapsulants for reliability and performance
- Reworkable Edgebond Adhesives | Zymet
Zymet's reworkable edgebond adhesives enhance board level reliability and ruggedize 3D and 2 5D packages, FO-WLP's, WLCSP's, BGA's, CSP's and QFN's They are used in high performance (HPC), enterprise, automotive, aerospace and consumer applications
- About Zymet
Zymet counts amongst its customers world-class multinational companies that are leaders in their industries Customers include manufacturers of handheld and consumer electronics, computers, storage devices, automotive electronics, medical electronics, and military electronics
- Zymet | Products
Zymet Products Adhesives Reworkable Edgebond Adhesives Ruggedize and raise board level reliability Anisotropically Conductive Adhesives Electrically interconnect and ground Electrically Conductive Adhesives Die attach and general electronics assembly Thermally Conductive Adhesives Dissipate heat Non-Conductive Pastes (NCPs)
- Underfill Encapsulants - Zymet
Zymet's high reliability underfill encapsulants both ruggedize and enhance board level reliability Their thermomechanical properties make them suited for enterprise, automotive, and other harsh environment applications
- Reworkable Underfill Encapsulants | Zymet
Zymet's reworkable underfill encapsulants: Ruggedize and raise board level reliability
- ザイメット - Zymet
ZYMET 製品 アンダーフィル封止剤 高信頼性用途のためのアンダーフィル封止剤 リワーク可能なアンダーフィル封止材 BGA、CSP、WL-CSP用 頑丈性能を高め、基板レベルの信頼性を向上させる リワーク可能なエッジボンド接着剤 耐久性と熱サイクル性能の向上
- 会社概要 ザイメット - Zymet
1986年に設立されたZymet（ザイメット）は、電子機器やマイクロエレクトロニクスの組み立てに使用される接着剤や封止剤のメーカーです。
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