What Is Underfill—the Ultimate Guide Underfill is a polymer or liquid epoxy resin, commonly used in CSP, BGA, WLP, Flip Chip, and other packaging structures
Underfills - Next Henkel Adhesives | Henkel Adhesives What are underfill materials? Underfills are epoxy-based encapsulants that bolster electrical interconnects against mechanical failure, increasing the reliability of advanced semiconductor packages and components connected to PCBs