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Octavo Systems – Page Array – System-In-Package Solution Providers Welcome to Octavo Systems We build System-in-Package (SiP) solutions that can be used as common building blocks in your electronic design Our goal is to make electronics easier and more accessible by abstracting away the tedious complexities that go along with designing an electronic system
OSDZU3 - Octavo Systems The Octavo Systems OSDZU3-REF is a full featured 4-layer development platform for the OSDZU3 System-in-Package devices Based on the UltraZED PCIe Carrier Card from Avnet the OSDZU3-REF provides access to a host of peripherals and expansion headers to fully evaluate the OSDZU3 in your application Its USB-C, USB 3 0, SATA Host, and 1Gb Ethernet interfaces support easy connectivity to off the
About Octavo Systems Octavo Systems, LLC was founded by three former Texas Instruments senior leaders It all started in 2013 over a discussion between two of the founders of how they could impact the semiconductor industry They believed that Moore’s law, as it was interpreted was missing a major transition of which the semiconductor industry was in the midst What they realized was that Moore’s Law was
OSD32MP15x - Octavo Systems The Octavo Systems OSD32MP1-BRK is a flexible prototyping platform for the OSD32MP15x System in Package The OSD32MP1-BRK gives access to over 100 I O on the STM32MP1 in a small form factor Featuring just the OSD32MP15x SiP, microSD card, a USB Port and 2 2×30 100 mil (2 54mm) headers, the OSD32MP1-BRK allows designers to quickly build prototypes that closely match their final system without
OSD335x - Octavo Systems The Octavo Systems OSD335x System-in-Package (SiP) device is the first device in the OSD335x Family It integrates the Texas Instruments Sitara ARM® Cortex®-A8 AM335x Processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, and all needed passive components into a single 27mm X 27mm BGA package
OSD335x-SM - Octavo Systems The Octavo Systems OSD3358-SM-RED platform is the official R eference, E valuation, and D evelopment board for the OSD335x-SM family of devices It was developed to allow designers to quickly evaluate the OSD335x-SM in their application
OSD62x - Octavo Systems The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the Texas Instruments AM62x processors to get their design to market faster and in a smaller form factor It enables them to build the next generation of building and industrial automation control, IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high
SiP Technology - Octavo Systems Why Octavo Systems? Octavo Systems is pioneering the use of System in Package technology to simplify the design and manufacture of electronic systems Our entire business is built to make adopting technology as easy as possible
OSDZU3-REF Getting Started Guide - Octavo Systems OSDZU3-REF Getting Started Guide Published On: January, 16, 2023 By: Eshtaartha Basu | Updated: September 26, 2024 by Greg Sheridan Welcome to the OSDZU3-REF, a full featured development platform for the OSDZU3 System in Package It provides access to most the commonly used peripherals on the OSDZU3 It also provides options for easy expandability through industry standard interfaces This
OSD62-PM-BRK - octavosystems. com The OSD62-PM-BRK is the official open-hardware development platform for the OSD62x-PM System-in-Package (SiP) This compact 4-inch by 1 2-inch (101 6mm x 30 48mm) board is designed for maximum flexibility and ease of use, providing direct access to every I O of the AM62 processor inside the OSD62-PM By leveraging the integration and size savings of the OSD62-PM, engineers can dramatically