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DIE CRACK PREVENTION AND DETECTION IN ADVANCED PACKAGING The solutions described in this presentation such as KERF metrology inspection, hairline crack, inner crack, backside crack inspection, IR image sensor, topography based image sensor combine software and hardware to improve the wafer sawing process control and increase the sensitivity to detect such cracks with minimal nuisance defects
Crack propagation and fracture in silicon wafers under thermal stress Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradients to produce thermal stress At temperatures where Si is still in the brittle regime, the strain may accumulate if a microcrack is pinned
Stress Diagnostics and Crack Detection in Full-Size Silicon Wafers . . . We demonstrated on a set of identical non-processed crystalline Si wafers with introduced periphery cracks that the crack shifts a selected RUV peak to a lower frequency and increases the resonance peak’s half-width Both characteristics are gradually increased with the length of the crack
Detecting Micro Cracks on Sidewall of WLCSP - Cognex Wafer Level Chip Scale Packages (WLCSPs) have multiple layers and can develop micro cracks from damage caused by poor handling, excessive stress (i e , mounting of solder balls), or rough transport
Crack Detection in Single‐Crystalline Silicon Wafer Using Laser . . . In this paper, in order to detect the crack, we propose a laser generated Lamb wave method which is not only noncontact, but also reliable for the measurement The laser-ultrasonic generator and the laser-interferometer are used as a transmitter and a receiver, respectively
Die crack failure mechanism investigations depending on the time . . . - LAAS Finding the critical factors of a die crack is crucial for the root cause investigation, allowing the implementation of accurate corrective ac-tions The various analytical methods that can be employed are numer-ous [1] Some die cracks will be easily interpreted and a standard failure analysis (FA) approach will quickly lead to the true cause
Die Crack Detection in HVM is Critical for High Reliability Applications Die cracks are generally associated with the dicing process and may be conveniently categorized as hairline, sidewall, inner, or backside Each has distinct causes and requires a different approach to optimize detection The upper row contains diagrammatic representations of these types
EPTC 2000 Template - IEEE There were total of 7 potential factors priortized in causing the crack die occurrence, including saw street width, saw blade thickness, saw cutting method (single pass or step cut), trim form dambar cutting, lead frame, wafer EPI layer and degator cooling time