international micro industries (imi) offers state of the art wafer bumping and wafer level packaging wlp contract services via high aspect ratio, high precision electroplating and photolithography technology. imi offers complete solutions; wafers from received from the fabricator, bumped by imi, then sent directly to our clients in the advanced chip packaging, medical, automotive, sensor, rfid and mems industries world-wide.
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Company Address:
1951 Old Cuthbert Road - Building 404,HADDONFIELD,NJ,USA
ZIP Code: Postal Code:
8033
Telephone Number:
8566160051 (+1-856-616-0051)
Fax Number:
8566160226 (+1-856-616-0226)
Website:
imi-corp. com
Email:
USA SIC Code(Standard Industrial Classification Code):
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