- SARA Software | Center for Advanced Life Cycle Engineering - UMD
The CALCE SARA software uses physics-of-failure based principles to assess whether a part system can meet defined life cycle requirements based on its material, geometry, and operating characteristics
- calceSARA Software Release - UMD
The CALCE Simulation Assisted Reliability Assessment (SARA) software includes a variety of tools for assisting in life assessment and reliability estimation of electronic parts and assemblies
- CALCE Simulation Assisted Reliability Assessment (SARA) - DAU
The CALCE SARA software uses physics-of-failure based principles to assess whether a part system can meet defined life cycle requirements based on its material, geometry, and operating characteristics
- CALCE Releases Free CalceSARA Physics-of-Failure Software
CalceSARA software uses physics-of-failure-based reliability principles to assess time to failure of part system failure site Use this information to develop customized test plans and compare competing designs
- CalceSARA software provides life expectancy assessment of # . . . - Facebook
For over 25 years, the calceSARA software has provided a unique toolset including board assembly and component-level physics-of-failure-based #lifeAssessment modules Tin whiskers present an electrical shorting risk concern in electronic equipment with tin surface finished parts
- calceSARA PDF | PDF | Product Lifecycle | Reliability Engineering - Scribd
CalceSARA can be downloaded from the CALCE Web Site The web site provides software, user’s manuals, installation instructions, past workshop materials, and other software documentation Software is updated approximately every four months https: calce umd edu calce-sara-software Center of Advanced Life Cycle Engineering 9 University of Maryland
- Center for Advanced Life Cycle Engineering
Simulation Assisted Reliability Assessment (SARA) uses physics-of-failure based principles and software to assess whether a part or system can meet defined life cycle requirements based on its materials, geometry, and operating characteristics
- CalceSARA Software Presentations and Reports - UMD
Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3 5Ag) for High-Temperature Applications, E George, D Das, M Osterman, and M Pecht, Device and Materials Reliability, IEEE Transactions on , vol 11, no 2, pp 328-338, June 2011
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