- PRODUCT DATA SHEET NC-SMQ 75 - indium. com
NC-SMQ ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0 4% of paste or <5% of flux vehicle It is designed for reflow in a nitrogen atmosphere of 100ppm oxygen or less This product has superior wetting capabilities compared to most low-residue formulations, offers trouble-free probe
- NC-SMQ 75 Solder Paste - Indium Corporation
NC-SMQ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0 4% of paste or <5% of fl ux vehicle It is designed for refl ow in a nitrogen atmosphere of 100-ppm oxygen or less
- Indium Solder Paste NC-SMQ75 Ind#171 (95Pb5Sn) T4 91. 5%
NC-SMQ®75 is a halogen-free, no-clean solder pasteformulated to leave a completely benign, invisibleresidue of 0 4% of paste or <5% of flux vehicle
- Indium Corporation Tech Paper SMQ 75—A No-Clean Die-Attach Solder Paste . . .
To achieve high yields, it is important to ensure consistent volume deposits of dispensed solder paste over an 8- or 10-hour shift In most solder paste applications, a final bondline thickness of 40-80microns, with low voiding (<10% total), and low die tilt and skew, are typical
- NC-SMQ®75 Solder Paste - Adhesives and Sealants. com
It offers trouble-free probe testing and is available for fine pitch and ultra fine pitch printing as well as dispensing applications Designed for reflow in nitrogen atmospheres, NC-SMQ®75 offers superior joint appearance and excellent humidity resistance Indium Corporation, 1676 Lincoln Ave , PO Box 269, Utica, NY 13503
- NC-SMQ®75 Die-Attach Solder Paste Datasheet - Datasheet Directory
NC-SMQ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0 4% of paste or <5% of flux vehicle It is designed for reflow in a nitrogen atmosphere of 100-ppm oxygen or less
- PRODUCT DATA SHEET “Power-Safe” NC-SMQ75 - indium. com
“Power-Safe” NC-SMQ75 Die-Attach Solder Paste SIR Results Surface insulation resistance (SIR) test is for SMT failure modes, but may be indicative of utility in “Power-Safe” applications Compatibility with OMC NC-SMQ75 • Clip-bonded package • 1,000 hours thermal cycle (-55°C–150°C) • SEM of cross-section: – No evidence of flux
- NC-SMQ®75 Die-Attach Solder Paste PDS 98637 R1. pdf | indiumcorporation
Indium NC-SMQ®75 Die-Attach Solder Paste PDS 98637 R1 pdf We research, develop, and manufacture advanced electronics assembly materials solutions to the challenges of today, tomorrow, and the future
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