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- Amkor Technology - Semiconductor IC Packaging, Design Test Services
Amkor Technology, Inc is one of the world’s largest providers of outsourced (OSAT) semiconductor packaging, design, and test services
- DSMBGA - Amkor Technology
The DSMBGA allows molded assembly of active, passive and antenna tuner components on both sides of the substrate, along with compartmental or conformal shielding
- Wafer Bumping Services - Amkor Technology
Our China, Korea, Portugal and Taiwan bumping operations are co-located with wafer probe, assembly and final test, enabling Amkor to provide complete “turnkey” flip chip and WLCSP solutions in these key geographic locations
- 2. 5D 3D TSV Packaging - Amkor Technology
To enable TSVs in these 2 5D TSV architectures, Amkor has developed a number of backend technology platforms for high-volume processing of TSV-bearing wafers and assembly
- Package assembly design kits bring value to semiconductor designs
To simplify the design of the newest advanced packages, such as high-density fan-out (HDFO) and to address all these other constraints, Amkor has introduced the SmartPackageTM Package Assembly Design Kit (PADK) This article will discuss the need and value of such design kits
- Amkor’s 2. 5D Package and HDFO – Advanced . . . - Amkor Technology
To achieve this goal, microchips are attached and interconnected using μbump solder joints to a multi-layer, fine-line RDL and BGAs to form an intermediate assembly, and then connected to the FCBGA substrate to complete the heterogeneous package (see Figure 7)
- IC Design Services - Amkor Technology
Amkor’s design engineers are trained experts and experienced in the latest design tools and packaging technology We process thousands of new package designs for customers every year for existing or next-generation products
- 3D Stacked Die Packaging - Amkor Technology
Amkor’s die stacking technologies are widely deployed in high volume manufacturing across multiple factories and product lines Customers rely on Amkor’s turnkey and leading-edge capabilities in design, assembly and test to solve their most complex 3D packaging and time to market challenges
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