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- Learning to Decapsulate Integrated Circuits Using Acid Deposition
Repeat the acid deposition + acetone ultrasonic bath until the entire silicon die is exposed If the ultrasonic bath is unable to get any particular chunk of epoxy, use a thin syringe to apply light pressure over that area
- Decapping ICs (removing epoxy packaging from chips to expose . . . - YouTube
I thought it would be interesting to try decapping some chips This involves using fuming nitric acid, which also seemed fun, so I thought I would give it a go The process starts by milling
- packages - How to decap a chip to expose the die? - Electrical . . .
Any suggestions to open a surface mount package (TSOP, QFN etc) to expose the die? Possibilities tried or considered: Grind the top off with grinder - Some chips have no cavity between the die and the cap Soak in MEK - I heard this works but haven't tried it Why would I want to do this?
- Practical Methods for Decapping Chips - netspi. com
By carefully removing the protective casing, we can access the chip’s die, the tiny piece of silicon that contains the actual circuitry This blog post will guide you through methods of chip decapping that are practical for home or amateur lab settings
- Microsoft Word - Dobriyal_Priyanka_REV
Chemical decapsulation requires the use of fuming nitric (HNO3) and sulfuric acid (H2SO4) to break down the encapsulation material Fuming acids are preferred because they react and dissolve the overmold material fast without etching the Au wire bonds or Aluminum (Al) bond pads To preserve Cu wires, fuming H2SO4 is used
- ACI Technologies, Inc - SMTnet
For plastic packaging, de-cap requires chemical etching by strong acids In this Tech Tips article, de-cap by chemical etching will be outlined step by step Identify where the die is relative to the IC by x-ray inspection (Figure 1) The manufacturer datasheet may also provide information about the clearance from the top of the package to the die
- Decoupling Capacitor Insertion: Minimizing IR-Drop Violations
To avoid the Voltage Drop and Ground Bounce, we are using DECAP cells Decap cells work as charge reservoirs and support the power delivery network and making it robust and will help in to provide the protection of the circuit
- decap:start [Silicon Pr0n]
In order to protect the fragile die, epoxy is mechanically strong and very chemical resistant Strong chemicals, mechanical abrasion, or heat treatments can be used to remove epoxy
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